DIN EN 60191-6-12
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011
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| Organization: | DIN |
| Publication Date: | 1 December 2011 |
| Status: | active |
| Page Count: | 20 |
| ICS Code (Electrical and electronics engineering drawings): | 01.100.25 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
scope:
Der vorliegende Teil der IEC 60191 enthält übliche
Gehäusezeichnungen, Abmessungen und empfohlene Varianten für alle
Gehäuse für Feinraster-Land-Grid
Document History
DIN EN 60191-6-12
December 1, 2011
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011
Der vorliegende Teil der IEC 60191 enthält übliche Gehäusezeichnungen, Abmessungen und empfohlene Varianten für alle Gehäuse für Feinraster-Land-Grid-Array (FLGA) mit einem Rasterabstand der...
January 1, 2003
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch land grid array (FLGA); Rectangular type (IEC 60191-6-12:2002); German version EN 60191-6-12:2002
A description is not available for this item.
October 1, 2001
General design guideline for rectangular FLGA packages (IEC 47D/395/CDV:2000); German version prEN 60191-6-12:2000
A description is not available for this item.
References
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