UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

JEDEC JESD 22-A102

Accelerated Moisture Resistance - Unbiased Autoclave

inactive
Buy Now
Organization: JEDEC
Publication Date: 1 November 2010
Status: inactive
Page Count: 12
scope:

This test method applies primarily to moisture resistance evaluations and robustness testing. Samples are subjected to a condensing, highly humid atmosphere under pressure to force moisture into the package to uncover weaknesses such as delamination and metallization corrosion. This test is used to evaluate new packages or packages that have undergone changes in materials (e.g. mold compound, die passivation) or design (e.g., die/paddle sizes). However, this test should not be applied on laminate or tape based packages i.e. FR4 material, polyimide tape or equivalent.

Some cautions should be considered when performing this test and evaluating test results. Failure mechanisms, both internal (e.g., due to plastic package swelling from saturation) and external (e.g., dendritic growth of conducting material between leads), may be produced which are not applicable to the intended application use conditions. Most semiconductor components are not rated for field applications conditions exceeding 95% RH, including condensing moisture such as rain or fog. The combination of high humidity, high temperature (>Tg) and high pressure may produce unrealistic material failures because absorbed moisture typically decreases the glass transition temperature for most polymeric materials. Extrapolation of autoclave test results to arrive at an application life should be accomplished with care.

The purpose of the "Unbiased Autoclave Test" is performed to evaluate the moisture resistance integrity of non-hermetic packaged solid state devices using moisture condensing or moisture saturated steam environments. It is a highly accelerated test which employs conditions of pressure, humidity and temperature under condensing conditions to accelerate moisture penetration through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors passing through it. This test is used to identify failure mechanisms internal to the package and is destructive.

Document History

July 1, 2015
Accelerated Moisture Resistance - Unbiased Autoclave
This test method applies primarily to moisture resistance evaluations and robustness testing. Samples are subjected to a condensing, highly humid atmosphere under pressure to force moisture into the...
JEDEC JESD 22-A102
November 1, 2010
Accelerated Moisture Resistance - Unbiased Autoclave
This test method applies primarily to moisture resistance evaluations and robustness testing. Samples are subjected to a condensing, highly humid atmosphere under pressure to force moisture into the...
December 1, 2000
Accelerated Moisture Resistance - Unbiased Autoclave
This test allows the user to evaluate the moisture resistance of nonhermetic packaged solid state devices. The Unbiased Autoclave Test is performed to evaluate the moisture resistance integrity of...
December 1, 2000
Accelerated Moisture Resistance - Unbiased Autoclave
This test method applies primarily to moisture resistance evaluations and robustness testing. Samples are subjected to a condensing, highly humid atmosphere under pressure to force moisture into the...
March 1, 1991
Accelerated Moisture Resistance - Unbiased Autoclave (Revision of Test Method A102-A - Previously Published in JESD22)
A description is not available for this item.

References

Advertisement