CENELEC - EN 60191-6-21
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 October 2010 |
| Status: | active |
| Page Count: | 18 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
This part of IEC 60191 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
Document History
EN 60191-6-21
October 1, 2010
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
This part of IEC 60191 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.