UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC - TM-650 2.6.21A

Service Temperature of Flexible Printed Boards

inactive
Organization: IPC
Publication Date: 1 May 2010
Status: inactive
Page Count: 4
scope:

This test method describes the procedure for establishing the service temperature for flexible metal-clad laminate as described in IPC-4204. The application of this method will allow the user to examine the dielectric strength, peel strength and any visual anomalies that occur after thermal aging.

Document History

TM-650 2.6.21B
June 1, 2011
Service Temperature of Metal-Clad Flexible Laminate, Cover Material and Adhesive Bonding Films
A description is not available for this item.
TM-650 2.6.21A
May 1, 2010
Service Temperature of Flexible Printed Boards
This test method describes the procedure for establishing the service temperature for flexible metal-clad laminate as described in IPC-4204. The application of this method will allow the user to...
TM-650 2.6.21
December 1, 1988
Service Temperature of Flexible Printed Wiring
A description is not available for this item.

References

This document references:
ASTM D149 - Standard Test Method for Dielectric Breakdown Voltage and Dielectric Strength of Solid Electrical Insulating Materials at Commercial Power Frequencies
Published by ASTM on January 1, 2020
This test method covers procedures for the determination of dielectric strength of solid insulating materials at commercial power frequencies, under specified conditions.2,3 Unless otherwise...
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
TM-650 2.4.13F - Solder Float Resistance Flexible Printed Wiring Materials
Published by IPC on May 1, 1998
This test method establishes and defines the procedures for determining the solder float resistance of copper foil clad and bare flexible dielectric material.
This document references:
TM-650 2.4.9E - Peel Strength, Flexible Dielectric Materials
Published by IPC on April 1, 2014
This test method defines the procedure for determining the bond strength of metal foils that are 18 microns thick or greater clad flexible dielectric material as nominally defined being measured with...
This document is referenced by:
IPC-3408 - General Requirements for Anisotropically Conductive Adhesive Films
Published by IPC on November 1, 1996
This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the...
This document is referenced by:
IPC-4203 - Cover and Bonding Material for Flexible Printed Circuitry
Published by IPC on March 1, 2018
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as...
View Less
View All
Advertisement