JEDEC JESD 22-B110
Mechanical Shock – Device and Subassembly
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| Organization: | JEDEC |
| Publication Date: | 1 June 2019 |
| Status: | active |
| Page Count: | 14 |
scope:
Device and Subassembly Mechanical Shock Test Method is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical Shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.
Document History
JEDEC JESD 22-B110
June 1, 2019
Mechanical Shock – Device and Subassembly
Device and Subassembly Mechanical Shock Test Method is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to...
July 1, 2013
Mechanical Shock – Component and Subassembly
Component and Subassembly Mechanical Shock Test Method is intended to evaluate components in the free state and assembled to printed wiring boards for use in electrical equipment. The method is...
November 1, 2004
Subassembly Mechanical Shock
The Subassembly Mechanical Shock Test Method is intended to describe a method to evaluate subassemblies for use in electrical equipment. It is intended to determine the compatibility of the...
November 1, 2004
Subassembly Mechanical Shock
The new test method JESD22-B110 provides guidance for in-situ testing of mechanical shock resistance of components as mounted in a subassembly. Using terms, procedures, and test levels in common with...
March 1, 2001
Subassembly Mechanical Shock
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