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IEC 60749-30

AMENDMENT 1 Semiconductor devices – Mechanical and climatic test methods – Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

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Organization: IEC
Publication Date: 1 May 2011
Status: inactive
Page Count: 14
ICS Code (Semiconductor devices in general): 31.080.01

Document History

August 1, 2020
Semiconductor devices – Mechanical and climatic test methods – Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the...
August 1, 2011
Semiconductor devices – Mechanical and climatic test methods – Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the...
IEC 60749-30
May 1, 2011
AMENDMENT 1 Semiconductor devices – Mechanical and climatic test methods – Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
A description is not available for this item.
January 1, 2005
Semiconductor devices Mechanical and climatic test methods Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
A description is not available for this item.
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