DSF/FprEN 60317-2
Specifications for particular types of winding wires -- Part 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer
| Organization: | DS |
| Status: | pending |
| Page Count: | 12 |
| ICS Code (Wires): | 29.060.10 |
scope:
This International Standard specifies the requirements of solderable enamelled round copper winding wire of class 130 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. Class 130 is a thermal class that requires a minimum temperature index of 130 and a heat shock temperature of at least 155 °C. The temperature in degrees Celsius corresponding to the temperature index is not necessarily that at which it is recommended that the wire be operated and this will depend on many factors, including the type of equipment involved. The range of nominal conductor diameters covered by this standard is: - Grade 1B: 0,020 mm up to and including 2,000 mm; - Grade 2B: 0,020 mm up to and including 2,000 mm. The nominal conductor diameters are specified in clause 4 of IEC 60317-0-1.
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