Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 1: Lead-free management
|Publication Date:||1 June 2011|
|ICS Code (Production. Production management):||03.100.50|
|ICS Code (Electronic components in general):||31.020|
|ICS Code (Aerospace electric equipment and systems):||49.060|
This PAS defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that Aerospace and High Performance (AHP) electronic systems containing Pb-free solder, piece parts, and boards will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance.
Its goal is to communicate requirements for a Lead-free Control Plan (LFCP), hereinafter referred to as the plan, and to assist suppliers in the development of their own plans. The plan documents the plan owner's (supplier's) processes, that assure their customers, and all other stakeholders that the plan owner's products will continue to meet their requirements3.
This PAS does not contain detailed descriptions of the processes to be documented but lists high-level requirements for such processes, and areas of concern to the AHP industries that must be addressed by the processes.
This PAS applies only to entities within the control of the AHP electronics system supply chain; and is intended to address issues that are unique to those industries.
Some applications may have unique requirements that exceed the scope of this PAS, and should be covered separately
3 This PAS was developed primarily for aerospace products; however, it also may be applicable, at the discretion of the user, to other products with similar characteristics, e.g., low-volume, rugged environments, high reliability, long lifetime, and repairability. Other industries may use this PAS by substituting the name of their industry for the word "aerospace" in this PAS.