scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Skew limit Device type Generic number Driver Receiver Circuit function 01 55976A1 8 9 9 Channel Differential Transceiver 02 55976A2 4 6 9 Channel Differential Transceiver

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDFP1-F56 56 Dual Flat Pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) .................................. −0.3 V dc to +6.0 V dc Voltage range at any bus terminal ........................... −10 V dc to +15 V dc Data I/O and control (A-side) voltage range ................. −0.3 V dc to V_CC + 0.5 V dc Electrostatic discharge: B side and GND, Class 3, A: ....... 12 kV 3/ B side and GND, Class 3, B: ....... 400 V 3/ All terminals, Class 3, A: ........ 4 kV All terminals, Class 3, B: ........ 400 V Storage temperature range (T_STG) ............................ −65°C to +150°C Lead temperature, soldering 1.6 mm(1/16 inch) from case for 10 seconds ................................... +260°C Junction-to-ambient thermal resistance, (Θ_JA) ............... 95.4°C/W Junction-to-case thermal resistance, (Θ_JC) .................. 5.67°C/W Thermal-shutdown junction temperature, (T_JS) ................ 165°C Maximum power dissipation at T_A = 125°C (in still air) (P_D) . 260°mW

Supply voltage range (V_CC) .................................. +4.75 V dc to +5.25 V dc Minimum high level input voltage (V_IH) (except nB+, nB−) .... +2.0 V Maximum low level input voltage (V_IL) (except nB+, nB−) ..... +0.8 V Voltage at any bus terminal or common mode), (V_O, V_I or V_IC) (nB+ or nB−) ........................... −7 V dc min, 12 V dc max High level output current (I_OH) (Driver) .................... −60 mA (Receiver) ................... −8 mA Low level output current (I_OL) (Driver) ..................... +60 mA (Receiver) ................... +8 mA Ambient operating temperature range (T_A) .................... −55°C to +125°C

intended Use: