scope:

This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence of this document by the manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow).

Devices that could be surface mounted, but are designed/intended to only be socketed, are out of scope of this test method.

NOTE For good correlation of results between moisture/reflow-induced stress sensitivity testing (per J-STD-020 and JESD22-A113) and actual reflow conditions used, identical temperature measurements by both the SMD manufacturer and the board assembler are necessary. Therefore, it is recommended that the package temperature at the top center of the package be determined during assembly board reflow profile setup, to ensure that it does not exceed the evaluation temperature based on package thickness and volume as stated in J-STD-020.