UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

NPFC - MIL-PRF-31032/2

PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING

active, Most Current
Buy Now
Organization: NPFC
Publication Date: 2 March 2020
Status: active
Page Count: 27
scope:

Scope.

This specification covers the generic performance requirements for rigid, single and double sided (1 or 2 conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes that will use soldering for component/part mounting (see 6.1.1).

intended Use:

This specification sheet was developed for the use of verifying the performance of rigid, woven glass reinforced, thermosetting resin base materials, single and double sided printed wiring boards,... View More

Document History

MIL-PRF-31032/2
March 2, 2020
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven glass reinforced, thermosetting resin base materials, single and double sided printed wiring boards,...
June 12, 2018
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven glass reinforced, thermosetting resin base materials, single and double sided printed wiring boards,...
June 2, 2017
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven glass reinforced, thermosetting resin base materials, single and double sided printed wiring boards,...
November 2, 2012
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven glass reinforced, thermosetting resin base materials, single and double sided printed wiring boards,...
June 14, 2010
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven glass reinforced, thermosetting resin base materials, single and double sided printed wiring boards,...
July 4, 2009
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven glass reinforced, thermosetting resin base materials, single and double sided printed wiring boards,...
April 23, 2008
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven glass reinforced, thermosetting resin base materials, single and double sided printed wiring boards,...
October 31, 2006
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven glass reinforced, thermosetting resin base materials, single and double sided printed wiring boards,...
February 24, 2006
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven glass reinforced, thermosetting resin base materials, single and double sided printed wiring boards...
October 29, 2004
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING
This specification sheet was developed for the use of verifying the performance of rigid, woven glass reinforced, thermosetting resin base materials, single and double sided printed wiring boards...
October 31, 1996
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING
This associated specification was developed for the use of verifying performance characteristics of rigid woven E-glass, thermoset resin base materials, for single or double sided (1 or 2 conductor...

References

Advertisement