This associated specification was developed for the use of verifying performance characteristics of rigid woven E-glass, thermoset resin base materials, for single or double sided (1 or 2 conductor layers) printed wiring boards with or without plated holes, that will use soldering for component/part joining. Printed wiring boards of other base material types (such as thermoplastic base materials) or printed board construction styles (such as muftilayered) can be verified to the performance requirements contained in this document, however, the performance parameters and baseline verification methods of other associated specifications are more suitable for those technologies. The supplement for MIL-PRF-31032 lists all of the applicable and current associated specifications at the time of its date.