NPFC - MIL-PRF-31032/2
PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED–THROUGH HOLES, FOR SOLDERED PART MOUNTING
| Organization: | NPFC |
| Publication Date: | 14 June 2010 |
| Status: | inactive |
| Page Count: | 25 |
scope:
This specification covers the generic performance requirements for rigid, single and double sided (1 or 2 conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes that will use soldering for component/part mounting (see 6.1.1).
intended Use:
This specification sheet was developed for the use of verifying the performance of rigid, woven glass reinforced, thermosetting resin base materials, single and double sided printed wiring boards,... View More
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