scope:

This specification covers the detail requirements for monolithic silicon, advanced CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance (RHA) are provided and are reflected in the complete Part on Identifying Number (PIN). The PIN shall be formulated in accordance with MIL-M-38510.

The device types shall be as follows:

Device type Circuit 01 To be included after dating 02 To be included after dating 03 Octal bidirectional transceiver with three-state outputs 04 To be included after dating 05 Octal noninverting bus transceiver with three-state outputs 06 Octal bidirectional transceiver with three-state outputs 07 Octal bidirectional transceiver with three-state outputs 08 Octal transceiver/register with three-state outputs 09 Octal transceiver/register with three-state outputs

The device class shall be the product assurance level as defined in MIL-M-38510.

The case outlines shall be designated as follows:

Outline letter Case outline (see MIL-M-38510, appendix C) K F-6 (24-lead, .640" × .420" × .090"), flat package L D-9 (24-lead, 1.280" × .310" × 200"), dual-in-line package R D-8 (20-lead, 1.060" × .310" × .200"), dual-in-line package S F-9 (20-lead, .540" × .300" × .100"), flat package 2 C-2 (20 terminal, .358" × .358" × .100"), square chip carrier package 3 C-4 (28 terminal, .460" × .460" × .100"), square chip carrier package

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Rome Laboratory (RL/ERDS), Griffiss AFB, NY 13441-5700, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

Supply voltage range (V_CC) - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC input voltage range (V_IN) - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc DC output voltage range (V_OUT) - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc Clamp diode current (I_IK, I_OK) - - - - - - - - - ±20 mA DC output current (I_OUT) - - - - - - - - - - - - ±50 mA DC VCC or GND current (I_CC, I_GND)- - - - - - - - ±100 mA Storage temperature range (t_STG) - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - +300°C Thermal resistance, junction-to-case (Θ_JC) - - - See MIL-M-38510, Appendix C Junction temperature (T_J)- - - - - - - - - - - - +175°C

Supply voltage range (V_CC) - - - - - - - - - - - +3.0 V dc to +5.5 V dc Input voltage range (V_IN) - - - - - - - - - - - +0.0 V dc to VCC Output voltage range (V_OUT)- - - - - - - - - - - +0.0 V dc to VCC Case operating temperature range (T_C)- - - - - - −55°C to +125°C Maximum low level input voltage (V_IL)- - - - - - 0.90 V at V_CC = 3.0 V 1.35 V at V_CC = 4.5 V 1.65 V at V_CC = 5.5 V Minimum high level input voltage (V_IH) - - - - - 2.10 V at V_CC = 3.0 V 3.15 V at V_CC = 4.5 V 3.85 V at V_CC = 5.5 V Input rise and fall rate (t_r, t_f) maximum: V_CC = 3.6 V, V_CC = 5.5 V - - - - - - - - - - - - 8 ns/V Minimum set-up time, high or low, bus to clock (t_s): Device types 08 09 V_CC = 3.0 V dc; T_C = +25°C, −55°C- - - - - - - - 5.0 ns 3.0 ns T_C = +125°C - - - - - - - - - - - 6.0 ns 4.0 ns V_CC = 4.5 V dc; T_C = +25°C, −55°C- - - - - - - - 4.0 ns 2.0 ns T_C = +125°C - - - - - - - - - - - 4.5 ns 2.5 ns Minimum hold time, high or low, bus to clock (t_h): Device types 08 09 V_CC = 3.0 V dc; T_C = +25°C, +125°C - - - - - - - 1.0 ns 0.0 ns T_C = 55°C - - - - - - - - - - - 1.5 ns 0.0 ns V_CC = 4.5 V dc; T_C = +25°C, +125°C - - - - - - - 1.5 ns 1.0 ns T_C = −55°C - - - - - - - - - - - 2.0 ns 1.0 ns Minimum clock pulse width (t_w) high or low: Device types 08 09 V_CC = 3.0 V dc; T_C = +25°C, −55°C - - - - - - - - 5.0 ns 3.5 ns T_C = +125°C - - - - - - - - - - - 5.0 ns 4.5 ns V_CC = 4.5 V dc; T_C = +25°C, −55°C - - - - - - - - 5.0 ns 2.0 ns T_C = +125°C - - - - - - - - - - - 5.0 ns 3.5 ns

intended Use:

Microcircuits conforming to this specification are intended for original equipment design application and logistic support of existing equipment.