scope:

This document addresses the quality of measured S-parameters for electrical printed circuit board (PCB) and related interconnect at frequencies up to 50 GHz. This might include, but is not limited to: test fixtures, as well as methods and processes for controlling the accuracy and consistency of measured data for broadband signals with frequency content up to 50 GHz. The standard is applicable to:

- PCB and related interconnects (including package, connector, cable, etc.) used in high-speed digital applications, operating with signals at frequencies up to 50 GHz

- Most industries using such interconnects

- Major measurement approaches (time domain or frequency domain) for collecting scattering (S-parameter) data

- Significant methods of removing/de-embedding fixture and instrumentation effects

Purpose

The purpose of this standard is to define methodologies by which high-quality scattering parameters (S-parameters) can be obtained for electrical interconnects that are intended to operate at microwave frequencies (up to 50 GHz). The standard includes requirements for designing test fixtures, evaluating measured data, removing test fixture and instrumentation effects, and verifying the quality of the S-parameters. The primary focus of this standard development is measured S-parameters. However, the methodology is applicable to simulated S-parameters as well.

Note that this standard defines a set of metrics to be calculated and reported to the recipient of the S-parameter data. In order to comply with this standard, the values of the metrics shall be included in S-parameter data file. However, the determination of pass/fail status of the results is out of the scope of this standard, and is left to the recipient of the data.

Although the highest frequency of interest is set at 50 GHz in this document, the methodology is generally applicable to higher frequencies. The methods and techniques contained herein have been validated only to 50 GHz as of this writing.