BSI - BS EN IEC 61189-5-601
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-601: General test methods for materials and assemblies — Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
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| Organization: | BSI |
| Publication Date: | 31 March 2021 |
| Status: | active |
| Page Count: | 46 |
| ICS Code (Electrical and electronic testing): | 19.080 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
BS EN IEC 61189-5-601
March 31, 2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-601: General test methods for materials and assemblies — Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
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