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BSI - BS EN IEC 61189-5-601

Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-601: General test methods for materials and assemblies — Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

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Organization: BSI
Publication Date: 31 March 2021
Status: active
Page Count: 46
ICS Code (Electrical and electronic testing): 19.080
ICS Code (Printed circuits and boards): 31.180

Document History

BS EN IEC 61189-5-601
March 31, 2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-601: General test methods for materials and assemblies — Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
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