DOD - SMD 5962-20209
MICROCIRCUIT, DIGITAL, CERAMIC, NON-HERMATIC FLIP CHIP (CLASS Y DEVICE), POWER QUICC III INTEGRATED PROCESSOR, MONOLITHIC SILICON
Organization: | DOD |
Publication Date: | 9 March 2021 |
Status: | active |
Page Count: | 69 |
scope:
Scope.
This drawing documents product assurance class level consisting of high reliability space application device class Y ceramic non-hermetic flip chip device. A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Document History
