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DOD - SMD 5962-20209

MICROCIRCUIT, DIGITAL, CERAMIC, NON-HERMATIC FLIP CHIP (CLASS Y DEVICE), POWER QUICC III INTEGRATED PROCESSOR, MONOLITHIC SILICON

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Organization: DOD
Publication Date: 9 March 2021
Status: active
Page Count: 69
scope:

Scope.

This drawing documents product assurance class level consisting of high reliability space application device class Y ceramic non-hermetic flip chip device. A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

Document History

SMD 5962-20209
March 9, 2021
MICROCIRCUIT, DIGITAL, CERAMIC, NON-HERMATIC FLIP CHIP (CLASS Y DEVICE), POWER QUICC III INTEGRATED PROCESSOR, MONOLITHIC SILICON
Scope. This drawing documents product assurance class level consisting of high reliability space application device class Y ceramic non-hermetic flip chip device. A choice of case outlines and lead...

References

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