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JEDEC JESD 51-6

Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)

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Organization: JEDEC
Publication Date: 1 March 1999
Status: active
Page Count: 20
scope:

This standard specifies the environmental conditions for determining thermal performance of an integrated circuit device in a forced convection environment when mounted on a standard thermal test board.

Document History

JEDEC JESD 51-6
March 1, 1999
Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
This standard specifies the environmental conditions for determining thermal performance of an integrated circuit device in a forced convection environment when mounted on a standard thermal test...

References

This document is referenced by:
DSCC-VID-V62/12660 REV A - MICROCIRCUIT, DIGITAL-LINEAR, 16 BIT, 65 MSPS, 1.8 V ANALOG TO DIGITAL CONVERTER, MONOLITHIC SILICON
Published by DLA on October 10, 2019
Scope. This drawing documents the general requirements of a high performance 16 bit, 65 million samples per second (MSPS), 1.8 V analog to digital converter microcircuit, with an operating...
This document is referenced by:
DSCC-VID-V62/13626 REV A - MICROCIRCUIT, LINEAR, 1.2 GHz, CLOCK FANOUT BUFFER, MONOLITHIC SILICON
Published by DLA on January 23, 2019
This drawing documents the general requirements of a high performance 1.2 GHz clock fanout buffer microcircuit, with an operating temperature range of -55°C to +105°C.
This document is referenced by:
JEDEC JESD 51-12 - Guidelines for Reporting and Using Electronic Package Thermal Information
Published by JEDEC on November 1, 2012
This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used...
This document is referenced by:
IEC 62258-6 - Semiconductor die products – Part 6: Requirements for information concerning thermal simulation
Published by IEC on August 1, 2006
This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: • wafers; • singulated bare die; • die and wafers with attached...
This document is referenced by:
DSCC-VID-V62/14623 REV A - MICROCIRCUIT, DIGITAL, POWER QUICC III INTEGRATED PROCESSOR, MONOLITHIC SILICON
Published by DLA on August 16, 2017
This drawing documents the general requirements of a high performance power QUICC III integrated processor microcircuit, with an operating temperature range of -55°C to +125°C.
This document is referenced by:
DSCC-VID-V62/14637 REV A - MICROCIRCUIT, DIGITAL-LINEAR, OCTAL, 14 BIT 65 MSPS, SERIAL LVDS, 1.8 V ANALOG TO DIGITAL CONVERTER, MONOLITHIC SILICON
Published by DLA on May 13, 2020
Scope. This drawing documents the general requirements of a high performance octal, 14 bit, 65 million samples per second (MSPS), serial low voltage differential signaling (LVDS), 1.8 V analog to...
This document is referenced by:
SMD 5962-20209 - MICROCIRCUIT, DIGITAL, CERAMIC, NON-HERMATIC FLIP CHIP (CLASS Y DEVICE), POWER QUICC III INTEGRATED PROCESSOR, MONOLITHIC SILICON
Published by DOD on March 9, 2021
Scope. This drawing documents product assurance class level consisting of high reliability space application device class Y ceramic non-hermetic flip chip device. A choice of case outlines and lead...
This document is referenced by:
DSCC-VID-V62/16606 REV A - MICROCIRCUIT, DIGITAL-LINEAR, 14 BIT, 125 MSPS, 1.8 V DUAL ANALOG TO DIGITAL, MONOLITHIC SILICON
Published by DLA on June 10, 2021
Scope. This drawing documents the general requirements of a high performance14 bit, 125 million samples per second (MSPS), 1.8 V dual analog to digital converter microcircuit, with an operating...
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