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ECIA - EIA-364-53B

TP-53B Nitric Acid Vapor Test, Gold Finish Test Procedure for Electrical Connectors and Sockets

active, Most Current
Organization: ECIA
Publication Date: 1 May 2000
Status: active
Page Count: 20
scope:

This standard establishes test methods to determine the magnitude of porosity as well as other surface defects inherent in allocation of gold contact finishes.  

Document History

EIA-364-53B
May 1, 2000
TP-53B Nitric Acid Vapor Test, Gold Finish Test Procedure for Electrical Connectors and Sockets
This standard establishes test methods to determine the magnitude of porosity as well as other surface defects inherent in allocation of gold contact finishes.  
EIA-364-53
May 1, 2000
TP-53B Nitric Acid Vapor Test, Gold Finish Test Procedure for Electrical Connectors and Sockets
This standard establishes test methods to determine the magnitude of porosity as well as other surface defects inherent in application of gold contact finishes.
EIA-364-53
May 1, 2000
TP-53B Nitric Acid Vapor Test, Gold Finish Test Procedure for Electrical Connectors and Sockets
This standard establishes test methods to determine the magnitude of porosity as well as other surface defects inherent in application of gold contact finishes. Object It is the intent that the...
EIA-364-53
May 1, 2000
TP-53B Nitric Acid Vapor Test, Gold Finish Test Procedure for Electrical Connectors and Sockets
This standard establishes test methods to determine the magnitude of porosity as well as other surface defects inherent in application of gold contact finishes. Object It is the intent that the...
364-53A
June 1, 1997
TP-53A Nitric Acid Vapor Test, Gold Finish Test Procedure for Electrical Connectors and Sockets
A description is not available for this item.
364-53
January 1, 1986
TP-53 Nitric Acid Vapor Test, Gold Finish Test Procedure for Electrical Connectors
A description is not available for this item.
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References

This document is referenced by:
MIL-DTL-83734J - SOCKETS, PLUG-IN ELECTRONIC COMPONENTS, DUAL-IN-LINE (DIPS) AND SINGLE-IN-LINE PACKAGES (SIPS), GENERAL SPECIFICATION FOR
Published by DLA on April 25, 2022
Scope. This specification covers plug-in electronic component sockets for use on panel boards, printed circuit boards, and microelectronic components (see 6.1).
This document is referenced by:
MIL-DTL-24308K (1) - CONNECTORS, ELECTRIC, RECTANGULAR, NONENVIRONMENTAL, MINIATURE, POLARIZED SHELL, RACK AND PANEL, GENERAL SPECIFICATION FOR
Published by DLA on December 5, 2022
Scope. This specification covers the requirements for nonenvironmental, polarized shell, miniature, rack and panel connectors having pin and socket, crimp (removable), solder (nonremovable), or...
This document is referenced by:
IEEE 802.3 - Standard for Ethernet Amendment 4: Physical Layers and Management Parameters for 50 Gb/s, 200 Gb/s, and 400 Gb/s Operation over Single‐Mode Fiber
Published by IEEE on November 7, 2019
Abstract: This amendment to IEEE Std 802.3-2018 adds Physical Layer (PHY) specifications and management parameters for 50 Gb/s, 200 Gb/s, and 400 Gb/s operation over single-mode fiber with reaches of...
This document is referenced by:
MIL-PRF-39012F (4) - CONNECTORS, COAXIAL, RADIO FREQUENCY, GENERAL SPECIFICATION FOR
Published by DLA on July 15, 2022
Scope. This specification covers the general requirements and tests for radio frequency connectors used with flexible RF cables and certain other types of coaxial transmission lines.
This document is referenced by:
MIL-DTL-28840E (2) - CONNECTORS, ELECTRICAL, CIRCULAR, THREADED, HIGH SHOCK, HIGH DENSITY, SHIPBOARD, CLASS D, GENERAL SPECIFICATION FOR
Published by DLA on September 9, 2022
Scope. This specification covers circular electrical connectors with removable crimp type, front release contacts. These connectors are for use with jacketed cables in shipboard applications....
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