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CEI - EN IEC 62435-7

Electronic components - Long-term storage of electronic semiconductor devices Part 7: Micro-electromechanical devices

active, Most Current
Organization: CEI
Publication Date: 1 September 2021
Status: active
Page Count: 28
ICS Code (Electronic components in general): 31.020
scope:

This part of IEC 62435 on long-term storage applies to micro-electromechanical devices (MEMS) in long-term storage that can be used as part of obsolescence mitigation strategy. Long-term storage refers to a duration that may be more than 12 months for products scheduled for storage. Philosophy, good working practice, and general means to facilitate the successful long-term storage of electronic components are also addressed.

Document History

EN IEC 62435-7
September 1, 2021
Electronic components - Long-term storage of electronic semiconductor devices Part 7: Micro-electromechanical devices
This part of IEC 62435 on long-term storage applies to micro-electromechanical devices (MEMS) in long-term storage that can be used as part of obsolescence mitigation strategy. Long-term storage...

References

This document references:
IEC 60050-561 - AMENDMENT 1 International electrotechnical vocabulary – Part 561: Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection
Published by IEC on December 1, 2016
A description is not available for this item.
This document references:
IEC 60721-3-1 - Classification of environmental conditions – Part 3-1: Classification of groups of environmental parameters and their severities – Storage
Published by IEC on February 1, 2018
This part of IEC 60721 classifies the groups of environmental parameters and their severities to which products together with their packaging, if any, are subjected when stored. The environmental...
This document references:
IEC/TR 62258-3 - Semiconductor die products – Part 3: Recommendations for good practice in handling, packing and storage
Published by IEC on August 1, 2010
This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers, – singulated bare die, – die and wafers with attached...
This document references:
IEC 60749-20 - Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Published by IEC on August 1, 2020
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
This document references:
IEC 60749-20-1 - Semiconductor devices – Mechanical and climatic test methods – Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
Published by IEC on June 1, 2019
This part of IEC 60749 applies to all devices subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages, process sensitive devices, and other...
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