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IEC - 63275-1

Semiconductor devices – Reliability test method for silicon carbide discrete metal‑oxide semiconductor field effect transistors – Part 1: Test method for bias temperature instability

active, Most Current
Organization: IEC
Publication Date: 1 April 2022
Status: active
Page Count: 30
ICS Code (Transistors): 31.080.30
scope:

This part of IEC 63275 gives a test method to evaluate gate threshold voltage shift of silicon carbide (SiC) power metal-oxide-semiconductor field-effect transistors (MOSFETs) using room temperature readout after applying continuous positive gate-source voltage stress at elevated temperature. The proposed method accepts a certain amount of recovery by allowing large delay times between stress and measurement (up to 10 h).

Document History

63275-1
April 1, 2022
Semiconductor devices – Reliability test method for silicon carbide discrete metal‑oxide semiconductor field effect transistors – Part 1: Test method for bias temperature instability
This part of IEC 63275 gives a test method to evaluate gate threshold voltage shift of silicon carbide (SiC) power metal-oxide-semiconductor field-effect transistors (MOSFETs) using room temperature...

References

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