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DLA - MIL-PRF-39010/19 (2)

COILS, RADIO FREQUENCY, MOLDED, PHENOLIC CORE, FIXED, SURFACE MOUNT ESTABLISHED RELIABILITY & NON-ESTABLISHED RELIABILITY

active, Most Current
Organization: DLA
Publication Date: 14 December 2022
Status: active
Page Count: 5

Document History

MIL-PRF-39010/19 (2)
December 14, 2022
COILS, RADIO FREQUENCY, MOLDED, PHENOLIC CORE, FIXED, SURFACE MOUNT ESTABLISHED RELIABILITY & NON-ESTABLISHED RELIABILITY
A description is not available for this item.
MIL-PRF-39010/19
September 6, 2018
COILS, RADIO FREQUENCY, MOLDED, PHENOLIC CORE, FIXED, SURFACE MOUNT ESTABLISHED RELIABILITY & NON-ESTABLISHED RELIABILITY
A description is not available for this item.
MIL-PRF-39010/19
September 20, 2013
COILS, RADIO FREQUENCY, MOLDED, PHENOLIC CORE, FIXED, SURFACE MOUNT ESTABLISHED RELIABILITY & NON-ESTABLISHED RELIABILITY
A description is not available for this item.

References

This document references:
MIL-PRF-39010 - COIL, RADIO FREQUENCY, FIXED, MOLDED, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
Published by NPFC on August 27, 1997
A description is not available for this item.
This document references:
MIL-STD-202-106 - TEST METHOD STANDARD METHOD 106, MOISTURE RESISTANCE
Published by NPFC on April 18, 2015
Purpose. The moisture resistance test is performed for the purpose of evaluating, in an accelerated manner, the resistance of component parts and constituent materials to the deteriorative effects of...
This document references:
MIL-STD-202-208 - TEST METHOD STANDARD METHOD 208, SOLDERABILITY
Published by NPFC on January 26, 2020
Purpose. The purpose of this test method is to determine the solderability of all terminations which are normally joined by a soldering operation. This determination is made on the basis of the...
This document references:
MIL-STD-202-210 - TEST METHOD STANDARD METHOD 210, RESISTANCE TO SOLDERING HEAT
Published by NPFC on April 18, 2015
Purpose. This test is performed to determine whether wire and other component parts can withstand the effects of the heat to which they will be subjected during the soldering process (solder iron,...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
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