scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01, 02 29FCTS20AT Multilevel pipeline registers with inverting three-state outputs, TTL compatible inputs, and limited output voltage swing 03, 04 29FCT520BT Multilevel pipeline registers with inverting three-state outputs, TTL compatible inputs, and limited output voltage swing 05, 06 29FCT520CT Multilevel pipeline registers with inverting three-state outputs, TTL compatible inputs, and limited output voltage swing

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835, and as follows:

Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat pack L GDIP1-T24 or CDIP2-T24 24 Dual-in-line 3 CQCC1-N28 28 Leadless-chip-carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall net be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and Interchangeable without preference.

Supply voltage range (V_CC). . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc DC input voltage range (V_IN). . . . . . . . . . . . . . . −0.5 V dc to V_CC + 0.5 V dc 4/ DC output voltage range (V_OUT). . . . . . . . . . . . . . −0.5 V dc to V_CC + 0.5 V dc 4/ DC input clamp current (I_IK) (V_IN = −0.5 V) . . . . . . . −20 mA DC output clamp current (I_OK) (V_OUT = −0.5 V and +7.0 V). . ±20 mA DC output source current (I_OH) per output . . . . . . . . −30 mA DC output sink current (I_OL) per output.. . . . . . . . . +70 mA DC V_CC current (I_CC) . . . . . . . . . . . . . . . . . ±268 mA DC ground current (I_GND) . . . . . . . . . . . . . . . . ±588 mA Storage temperature range (T_STG) . . . . . . . . . . . . −65°C to +150°C ......Case temperature under bias (T_BIAS). . . . . . . . . . . . −65°C to +135°C ......Maximum power dissipation (P_D) . . . . . . . . . . . . . . 500 mW ......Lead temperature (soldering, 10 seconds) . . . . . . . . . +300°C ......Thermal resistance, junction-to-case (θ_JC) . . . . . . . . See MIL-STD-1835 ......Junction temperature (T_J) . . . . . . . . . . . . . . . . +175°C

Supply voltage range (V_CC) . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Input voltage range (V_IN). . . . . . . . . . . . . +0.0 V dc to V_CC Output voltage range (V_OUT). . . . . . . . . . . . +0.0 V dc to V_CC Maximum low level input voltage (V_IL). . . . . . . 0.8 V Minimum high level input voltage (V_IH).. . . . . . 2.0 V Case operating temperature range (T_C). . . . . . . −55°C to +125°C Maximum input rise and fall rate (t_r, t_f): (from V_IN = 0.3 V to 2.7 V, 2.7 V to 0.3 V). . . 5 ns/V Maximum high level output current (I_OH). . . . . . −12 mA Maximum low level output current (I_OL) . . . . . . +32 mA

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012). . . . . . . XX percent 5/

intended Use: