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BSI - BS EN 62326-4-1

Printed Boards Part 4: Rigid Multilayer Printed Boards with Interlayer Connections - Sectional Specification Section 1: Capability Detail Specification - Performance Levels A, B and C

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Organization: BSI
Publication Date: 15 June 1997
Status: active
Page Count: 68
ICS Code (Printed circuits and boards): 31.180

Document History

BS EN 62326-4-1
June 15, 1997
Printed Boards Part 4: Rigid Multilayer Printed Boards with Interlayer Connections - Sectional Specification Section 1: Capability Detail Specification - Performance Levels A, B and C
A description is not available for this item.

References

This document references:
IEC 60068-2-38 - Environmental testing – Part 2-38: Tests – Test Z/AD: Composite temperature/humidity cyclic test
Published by IEC on March 1, 2021
This part of IEC 60068 specifies a composite test procedure, primarily intended for component type specimens, to determine, in an accelerated manner, the resistance of specimens to the deteriorative...
This document references:
IEC 61249-4-1 - Materials for printed boards and other interconnecting structures – Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) – Epoxide woven E-glass prepreg of defined flammability
Published by IEC on January 1, 2008
A description is not available for this item.
This document references:
IEC 61249-2-7 - Materials for Printed Boards and Other Interconnecting Structures - Part 2-7: Reinforced Base Materials Clad and Unclad - Epoxide Woven E-Glass Laminated Sheet of Defined Flammability (Vertical Burning Test), Copper-Clad
Published by IEC on March 1, 2002
A description is not available for this item.
This document references:
HD 323.2.3 S2 - Basic Environmental Testing Procedures - Part 2: Tests. Test Ca: Damp Heat, Steady State
Published by CENELEC on January 1, 1987
A description is not available for this item.
This document references:
IEC 61189-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3: Test methods for interconnection structures (printed boards)
Published by IEC on October 1, 2007
Scope and object This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
This document is referenced by:
BS EN 60079-18 - Explosive atmospheres Part 18: Equipment protection by encapsulation "m"
Published by BSI on June 30, 2015
A description is not available for this item.
This document is referenced by:
BS EN 62326-4 - Printed Boards Part 4: Rigid Multilayer Printed Boards with Interlayer Connections - Sectional Specification
Published by BSI on June 15, 1997
A description is not available for this item.
This document is referenced by:
BS EN 62326-1 - Printed Boards Part 1: Generic Specification
Published by BSI on August 16, 2002
A description is not available for this item.
This document is referenced by:
BS EN 61189-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Published by BSI on March 31, 2008
A description is not available for this item.
This document is referenced by:
BS EN 61249-8-8 - Materials for Interconnection Structures Part 8: Sectional Specification Set for Non-Conductive Films and Coatings Section 8: Temporary Polymer Coatings
Published by BSI on December 15, 1997
A description is not available for this item.
This document is referenced by:
BS EN 62326-1 - Printed Boards Part 1: Generic Specification
Published by BSI on August 16, 2002
A description is not available for this item.
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