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IPC-2581

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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Organization: IPC
Publication Date: 1 May 2012
Status: inactive
Page Count: 210

Document History

IPC-2581
November 1, 2020
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling,...
IPC-2581
December 1, 2016
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling,...
IPC-2581
September 1, 2013
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling,...
IPC-2581
May 1, 2012
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
A description is not available for this item.
IPC-2581
March 1, 2004
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling,...
IPC-2581
March 1, 2004
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling,...
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References

This document references:
ASME Y14.5 - Dimensioning and Tolerancing
Published by ASME on January 1, 2018
INTRODUCTION This Standard establishes symbols, rules, definitions, requirements, defaults, and recommended practices for stating and interpreting dimensioning, tolerancing, and related requirements...
This document references:
IPC-2220 FAM - 2220 Series of Design Documents
Published by IPC
A description is not available for this item.
This document references:
IPC-2501 - Definition for Web-Based Exchange of XML Data (Message Broker)
Published by IPC on July 1, 2003
The intent of this standard is to establish the governing semantics and an XML based syntax for shop floor communication between electronic assembly equipment and associated software applications....
This document references:
IPC-2571 - Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX)
Published by IPC on November 1, 2001
The Product Data eXchange 1.0 standard defines an XML encoding scheme that enables a total product definition to be described at a level appropriate to facilitate supply chain interactions. The...
This document references:
IPC-2576 - Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Data eXchange (PDX)
Published by IPC on November 1, 2001
This standard covers the sectional requirements for product genealogy, or as-built manufacturing information. The standard facilitates the exchange of manufacturing information between supply chain...
This document is referenced by:
IPC-7095 - Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
Published by IPC on June 1, 2018
This standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design...
This document is referenced by:
CEI EN 61182-2-2 - Printed board assembly products - Manufacturing description data and transfer methodology Part 2-2: Sectional requirements for implementation of printed board fabrication data description
Published by CEI on January 1, 2013
This part of IEC 61182 provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard...
This document is referenced by:
DIN EN 61182-2-2 - Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description (IEC 61182-2-2:2012); German version EN 61182-2-2:2012
Published by DIN on August 1, 2013
Dieser Teil von IEC 61182 enthält Angaben zu den für die Leiterplattenfertigung verwendeten Herstellungsanforderungen. Diese Norm legt die in der Fachgrundnorm IEC 61182-2 und einigen der...
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