CEI EN 60749-30
Semiconductor devices - Mechanical and climatic test methods Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
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| Organization: | CEI |
| Publication Date: | 1 June 2012 |
| Status: | active |
| Page Count: | 12 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
Foreword
The text of document 47/2019/CDV, future amendment 1 to IEC 60749-30:2005, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as amendment A1 to EN 60749-30:2005 on 2011-06-29.
Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights.
Document History
June 1, 2021
Semiconductor devices - Mechanical and climatic test methods Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the...
CEI EN 60749-30
June 1, 2012
Semiconductor devices - Mechanical and climatic test methods Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Foreword
The text of document 47/2019/CDV, future amendment 1 to IEC 60749-30:2005, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by...
July 1, 2005
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
La presente Norma fa parte della serie 60749 : in essa viene descritta una procedura standard per determinare il precondizionamento dei dispositivi non ermetici a montaggio superficiale nella fase...