UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

CEI - EN IEC 60749-30

Semiconductor devices - Mechanical and climatic test methods Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

active, Most Current
Organization: CEI
Publication Date: 1 June 2021
Status: active
Page Count: 22
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.

The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.

These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).

NOTE 1 Correlation of moisture-induced stress sensitivity conditions (or moisture sensitivity levels (MSL)) in accordance with IEC 60749-20 and this document and the actual reflow conditions used are dependent upon identical temperature measurement by both the semiconductor manufacturer and the board assembler. Therefore, the temperature at the top of the package on the hottest moisture sensitive SMD during assembly is monitored to ensure that it does not exceed the temperature at which the components are evaluated.

NOTE 2 For the purpose of this document, SMD is restricted to include only plastic-encapsulated SMDs and other packages made with moisture-permeable materials.

Document History

EN IEC 60749-30
June 1, 2021
Semiconductor devices - Mechanical and climatic test methods Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the...
CEI EN 60749-30
June 1, 2012
Semiconductor devices - Mechanical and climatic test methods Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Foreword The text of document 47/2019/CDV, future amendment 1 to IEC 60749-30:2005, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by...
CEI EN 60749-30
July 1, 2005
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
La presente Norma fa parte della serie 60749 : in essa viene descritta una procedura standard per determinare il precondizionamento dei dispositivi non ermetici a montaggio superficiale nella fase...

References

This document references:
IEC 60749-11 - Semiconductor Devices - Mechanical and Climatic Test Methods - Part 11: Rapid Change of Temperature - Two-Fluid-Bath Method CORRIGENDUM 2
Published by IEC on August 1, 2003
A description is not available for this item.
This document references:
IEC 60749-20 - Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Published by IEC on August 1, 2020
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
This document references:
IEC 60749-24 - Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
Published by IEC on March 1, 2004
Scope and object The unbiased highly accelerated stress testing (HAST) is performed for the purpose of evaluating the reliability of non-hermetically packaged solid-state devices in humid...
This document references:
IEC 60749-25 - Semiconductor devices Mechanical and climatic test methods Part 25: Temperature cycling
Published by IEC on July 1, 2003
This part of IEC 60749 provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating...
This document references:
IEC 60749-33 - Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
Published by IEC on March 1, 2004
Scope and object The unbiased autoclave test is performed to evaluate the moisture resistance integrity of nonhermetic packaged solid-state devices using moisture condensing or moisture saturated...
This document references:
IEC 60749-4 - Semiconductor devices – Mechanical and climatic test methods – Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
Published by IEC on March 1, 2017
This part of IEC 60749 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid...
This document references:
IEC 60749-5 - Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
Published by IEC on April 1, 2017
This part of IEC 60749 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid...
View Less
View All
Advertisement