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IEC 60749-4

Semiconductor devices – Mechanical and climatic test methods – Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

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Organization: IEC
Publication Date: 1 March 2017
Status: active
Page Count: 14
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This part of IEC 60749 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments.

Document History

IEC 60749-4
March 1, 2017
Semiconductor devices – Mechanical and climatic test methods – Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
This part of IEC 60749 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid...
August 1, 2003
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 4: Damp Heat, Steady State, Highly Accelerated Stress Test (HAST) CORRIGENDUM 1
A description is not available for this item.
April 1, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
A description is not available for this item.

References

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