UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IEC 60749-4

Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

inactive
Buy Now
Organization: IEC
Publication Date: 1 April 2002
Status: inactive
Page Count: 24
ICS Code (Semiconductor devices in general): 31.080.01

Document History

March 1, 2017
Semiconductor devices – Mechanical and climatic test methods – Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
This part of IEC 60749 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid...
August 1, 2003
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 4: Damp Heat, Steady State, Highly Accelerated Stress Test (HAST) CORRIGENDUM 1
A description is not available for this item.
IEC 60749-4
April 1, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
A description is not available for this item.
Advertisement