IEC 60749-4
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
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| Organization: | IEC |
| Publication Date: | 1 April 2002 |
| Status: | inactive |
| Page Count: | 24 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
March 1, 2017
Semiconductor devices – Mechanical and climatic test methods – Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
This part of IEC 60749 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid...
August 1, 2003
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 4: Damp Heat, Steady State, Highly Accelerated Stress Test (HAST) CORRIGENDUM 1
A description is not available for this item.
IEC 60749-4
April 1, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
A description is not available for this item.