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IEC 60749-4

Semiconductor Devices - Mechanical and Climatic Test Methods - Part 4: Damp Heat, Steady State, Highly Accelerated Stress Test (HAST) CORRIGENDUM 1

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Organization: IEC
Publication Date: 1 August 2003
Status: inactive
Page Count: 22
ICS Code (Semiconductor devices in general): 31.080.01

Document History

March 1, 2017
Semiconductor devices – Mechanical and climatic test methods – Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
This part of IEC 60749 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid...
IEC 60749-4
August 1, 2003
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 4: Damp Heat, Steady State, Highly Accelerated Stress Test (HAST) CORRIGENDUM 1
A description is not available for this item.
April 1, 2002
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
A description is not available for this item.

References

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