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CENELEC - EN 61240

Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules

inactive
Organization: CENELEC
Publication Date: 1 October 2012
Status: inactive
Page Count: 22
ICS Code (Piezoelectric devices): 31.140
scope:

This International Standard sets out general rules for drawing all dimensional and geometrical characteristics of a surface-mounted piezoelectric device package (referred to in this standard as SMD) in order to ensure mechanical inter-changeability of all outline drawings of the SMDs for frequency control and selection.

Document History

EN 61240
January 1, 2017
Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
This International Standard sets out general rules for drawing all dimensional and geometrical characteristics of a surface-mounted piezoelectric device package (referred to in this document as SMD)...
EN 61240
October 1, 2012
Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
This International Standard sets out general rules for drawing all dimensional and geometrical characteristics of a surface-mounted piezoelectric device package (referred to in this standard as SMD)...
EN 61240
April 1, 1997
Piezoelectric Devices - Preparation of Outline Drawings of Surface-Mounted Devices (SMD) for Frequency Control and Selection - General Rules
A description is not available for this item.

References

This document references:
IEC 60191-6-1 - Mechanical Standardization of Semiconductor Devices - Part 6-1: General Rules for the Preparation of Outline Drawings of Surface Mounted Semiconductor Device Packages - Design Guide for Gull-Wing Lead Terminals
Published by IEC on October 1, 2001
A description is not available for this item.
This document references:
IEC 60191-6-10 - Mechanical standardization of semiconductor devices Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Dimensions of P-VSON
Published by IEC on November 1, 2003
A description is not available for this item.
This document references:
IEC 60191-6-12 - Mechanical standardization of semiconductor devices – Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guidelines for fine-pitch land grid array (FLGA)
Published by IEC on June 1, 2011
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.
This document references:
IEC 60191-6-13 - Mechanical standardization of semiconductor devices – Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Published by IEC on September 1, 2016
This part of IEC 60191 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC...
This document references:
IEC 60191-6-16 - Mechanical standardization of semiconductor devices – Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Published by IEC on April 1, 2007
A description is not available for this item.
This document is referenced by:
BS EN 61837-1 - Surface Mounted Piezoelectric Devices for Frequency Control and Selection - Standard Outlines and Terminal Lead Connections - Part 1: Plastic Moulded Enclosure Outlines
Published by BSI on September 30, 2012
A description is not available for this item.
This document is referenced by:
BS EN 61837-3 - Surface Mounted Piezoelectric Devices for Frequency Control and Selection - Standard Outlines and Terminal Lead Connections - Part 3: Metal Enclosures
Published by BSI on December 31, 2015
A description is not available for this item.
This document is referenced by:
EN IEC 61837-2 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
Published by CENELEC on July 1, 2018
This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is...
This document is referenced by:
BS EN IEC 61837-2 - Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections Part 2: Ceramic enclosures
Published by BSI on August 31, 2018
A description is not available for this item.
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