DLA - SMD-5962-93262
MICROCIRCUIT, LINEAR, CMOS, 6-BIT FLASH A/D CONVERTER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 31 May 1994 |
| Status: | inactive |
| Page Count: | 13 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 MN5906 6 Bit CMOS Flash A/D Converter
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style V GDIP1-T18 or CDIP2-T18 18 Dual-in-line
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Power supply voltage (VDD)- - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Analog input voltage (VAIN) - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +VDD +0.5 V dc Digital inputs (VIH, VIL) - - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +VDD +0.5 V dc Reference input voltage (VREF)- - - - - - - - - - - - - - - - - - - - - - - - - - 0 V to VDD + 0.5 V dc Storage temperature range - - - - - - - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds)- - - - - - - - - - - - - - - - - - - - - +300°C Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - - - - - - - - - - +175°C Thermal resistance, junction-to-ambient (θJA) - - - - - - - - - - - - - - - - - - 60°C/W Thermal resistance, junction-to-case (θJC) - - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Power dissipation (PD) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 300 mW
Ambient operating temperature range (TA) - - - - - - - - - - - - - - - - - - - - - −55°C to +125°C Supply Voltage (VDD)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - +5.0 V dc Upper reference voltage - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - +2.75 V dc Lower reference voltage - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 0 V
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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