scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 AD7837 Dual, 12-bit multiplying digital-to- analog converter 02 AD7847 Dual, 12-bit multiplying digital-to- analog converter

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and Qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

V_DD to DGND, AGNDA, AGNDB . . . . . . . . . . . . . . . −0.3 V to +17 V V_SS to DGND, AGNDA, AGNDB . . . . . . . . . . . . . . . −0.3 V to −17 V 2/ V_REFA, V_REFB to AGNDA, AGNDB . . . . . . . . . . . . . V_SS −0.3 V to V_DD +0.3 V AGNDA, AGNDB to DGND . . . . . . . . . . . . . . . . . −0.3 V to V_DD +0.3 V V_OUTA, V_OUTB to AGNDA, AGNDB . . . . . . . . . . . . . V_SS −0.3 V to V_DD +0.3 V 3/ R_FBA, R_FBB to AGNDA, AGNDB . . . . . . . . . . . . . . V_SS −0.3 V to V_DD +0.3 V 4/ Digital inputs to DGND . . . . . . . . . . . . . . . . −0.3 V to V_DD +0.3 V Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . +300°C Power dissipation to +75°C . . . . . . . . . . . . . . 1000 mW 5/ Thermal resistance, junction-to-case (Θ_JC) . . . . . . See MIL-STD-1835

Positive supply voltage (V_DD) . . . . . . . . . . . . . +15 V Negative supply voltage (V_SS) . . . . . . . . . . . . . −15 V Ambient temperature range (T_A) . . . . . . . . . . . . −55°C to +125°C

intended Use: