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CEI EN 62047-14

Semiconductor devices - Micro-electromechanical devices Part 14: Forming limit measuring method of metallic film materials

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Organization: CEI
Publication Date: 1 April 2013
Status: active
Page Count: 24
ICS Code (Other semiconductor devices): 31.080.99
scope:

This part of IEC 62047 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film materials described herein are typically used in electric components, MEMS and microdevices.

When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process.

Document History

CEI EN 62047-14
April 1, 2013
Semiconductor devices - Micro-electromechanical devices Part 14: Forming limit measuring method of metallic film materials
This part of IEC 62047 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 μm to 300 μm. The metallic film materials...

References

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