BSI - BS EN 61189-11
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
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| Organization: | BSI |
| Publication Date: | 31 July 2013 |
| Status: | active |
| Page Count: | 20 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
BS EN 61189-11
July 31, 2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
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