DLA - SMD-5962-96637 REV B
MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, NON-INVERTING HEX BUFFER/CONVERTER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 24 July 1997 |
| Status: | inactive |
| Page Count: | 26 |
scope:
This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part or Identification Number (PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN.
intended Use:
Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original... View More
Document History
