DLA - SMD-5962-96637 REV C
MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, NON-INVERTING HEX BUFFER/CONVERTER, MONOLITHIC SILICON
active, Most Current
| Organization: | DLA |
| Publication Date: | 11 December 2003 |
| Status: | active |
| Page Count: | 23 |
Document History
SMD-5962-96637 REV C
December 11, 2003
MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, NON-INVERTING HEX BUFFER/CONVERTER, MONOLITHIC SILICON
A description is not available for this item.
July 24, 1997
MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, NON-INVERTING HEX BUFFER/CONVERTER, MONOLITHIC SILICON
This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535...
November 29, 1996
MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, NON-INVERTING HEX BUFFER/CONVERTER, MONOLITHIC SILICON
A description is not available for this item.
December 14, 1995
MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, NON-INVERTING HEX BUFFER/CONVERTER, MONOLITHIC SILICON
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and...