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IPC-A-600 POLISH

Acceptability of Printed Boards

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Organization: IPC
Publication Date: 1 April 2010
Status: inactive
Page Count: 168

Document History

IPC-A-600 POLISH
May 1, 2016
Acceptability of Printed Boards
A description is not available for this item.
IPC-A-600 POLISH
April 1, 2010
Acceptability of Printed Boards
A description is not available for this item.
IPC-A-600 POLISH
July 1, 2004
Acceptability of Printed Boards
Niniejszy dokument opisuje stany preferowane, dopuszczalne i niezgodne z wymaganiami, które są dostrzegalne na zewnątrz lub wewnątrz płytek obwodów drukowanych. Dokument przedstawia interpretacje...

References

This document references:
IPC-TM-650 2.6.3 - Moisture and Insulation Resistance, Printed Boards
Published by IPC on May 1, 2004
This test method is to determine the degradation of insulating materials by examination of the visual and electrical insulation resistance properties of printed board specimens after exposure to high...
This document references:
J-STD-003 - Solderability Tests for Printed Boards
Published by IPC on April 1, 2014
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes...
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
IPC-TM-650 2.4.1 - Adhesion, Tape Testing
Published by IPC on May 1, 2004
This test method uses pressure sensitive tape to determine the adhesion quality of platings, marking inks or paints, and other materials used in conjunction with Printed Boards.
This document references:
IPC-TM-650 2.4.28.1 - Solder Mask Adhesion - Tape Test Method
Published by IPC on March 1, 2007
This test method defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated and reflowed solder printed boards both prior to and...
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