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DIN EN 62739-1

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (IEC 62739-1:2013); German version EN 62739-1:2013

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Organization: DIN
Publication Date: 1 February 2014
Status: active
Page Count: 19
ICS Code (Brazing and soldering): 25.160.50
scope:

Dieser Teil der Reihe IEC 62739 beschreibt ein Prüfverfahren zur Bewertung der Erosion von metallischen Werkstoffen ohne Oberflächenbehandlung, die zur Verwendung in Bleifrei-Wellenlötausrüstungen für Löttiegel und andere Komponenten, die mit geschmolzenem Lot in Kontakt kommen, vorgesehen sind.

Document History

DIN EN 62739-1
February 1, 2014
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (IEC 62739-1:2013); German version EN 62739-1:2013
Dieser Teil der Reihe IEC 62739 beschreibt ein Prüfverfahren zur Bewertung der Erosion von metallischen Werkstoffen ohne Oberflächenbehandlung, die zur Verwendung in Bleifrei-Wellenlötausrüstungen...
DIN EN 62739-1
November 1, 2011
Test method for erosion of wave soldering equipments by molten lead free solder alloy - Part 1: Erosion test method for the metallic material without surface treatment (IEC 91/987/CD:2011)
A description is not available for this item.

References

This document references:
EN IEC 61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Published by CENELEC on March 1, 2018
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
This document references:
IEC 61190-1-3 - Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by IEC on December 1, 2017
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
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