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DIN EN 61191-2

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2013); German version EN 61191-2:2013

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Organization: DIN
Publication Date: 1 February 2014
Status: inactive
Page Count: 28
ICS Code (Printed circuits and boards): 31.180
scope:

Dieser Teil von IEC 61191 enthält die Anforderungen an Lötverbindungen oberflächenmontierter Bauelemente. Die Anforderungen betreffen Baugruppen mit ausschließlich oberflächenmontierten Bauelementen oder oberflächenmontierte Teile von Baugruppen, die weitere verwandte Techniken (z. B. Durchsteck-, Chip-, Anschlussmontage u. a.) umfassen.

Document History

DIN EN 61191-2
February 1, 2020
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017/COR1:2019); German version EN 61191-2:2017/AC:2019
A description is not available for this item.
DIN EN 61191-2
May 1, 2018
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017
Dieser Teil von IEC 61191 enthält die Anforderungen an Lötverbindungen oberflächenmontierter Bauelemente. Die Anforderungen betreffen Baugruppen mit ausschließlich oberflächenmontierten Bauelementen...
DIN EN 61191-2
January 1, 2016
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 91/1285/CD:2015)
A description is not available for this item.
DIN EN 61191-2
February 1, 2014
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2013); German version EN 61191-2:2013
Dieser Teil von IEC 61191 enthält die Anforderungen an Lötverbindungen oberflächenmontierter Bauelemente. Die Anforderungen betreffen Baugruppen mit ausschließlich oberflächenmontierten Bauelementen...
DIN EN 61191-2
May 1, 2013
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 91/1091/FDIS:2013); German version FprEN 61191-2:2013
A description is not available for this item.
DIN EN 61191-2
June 1, 1999
Printed board assemblies - Part 2: Sectional specification: Requirements for surface mount soldered assemblies (IEC 61191-2:1998); German version EN 61191-2:1998
A description is not available for this item.
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References

This document references:
EN IEC 61191-1 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by CENELEC on November 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
This document references:
IEC 61191-1 - Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by IEC on September 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
This document references:
IPC-A-610 - Acceptability of Electronic Assemblies
Published by IPC on October 1, 2017
This Standard is a collection of visual quality acceptability requirements for electronic assemblies. This Standard does not provide criteria for cross-section evaluation. This document presents...
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