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IPC-4204

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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Organization: IPC
Publication Date: 1 October 2011
Status: inactive
Page Count: 60
scope:

This standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed circuitry and flexible flat cable.

Document History

IPC-4204
August 1, 2018
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
This standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible...
IPC-4204
October 1, 2013
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
A description is not available for this item.
IPC-4204
October 1, 2011
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible...
IPC-4204
October 1, 2011
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible...
IPC-4204
May 1, 2002
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible...

References

This document references:
ISO/IEC 17025 - General requirements for the competence of testing and calibration laboratories
Published by ISO on November 1, 2017
This document specifies the general requirements for the competence, impartiality and consistent operation of laboratories. This document is applicable to all organizations performing laboratory...
This document references:
TM-650 2.1.13B - Inspection for Voids in Flexible Printed Board Materials
Published by IPC on May 1, 2012
A description is not available for this item.
This document references:
IPC-TM-650 2.2.4 - Dimensional Stability, Flexible Dielectric Materials
Published by IPC on May 1, 1998
This test method is used to establish and define the procedures for determining thermal gradient dimensional changes of a plastic dielectric, metal clad or unclad. This method may also be used to...
This document is referenced by:
IPC-6013 - Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards
Published by IPC on April 1, 2018
A description is not available for this item.
This document is referenced by:
IPC-2221 CHINESE - Generic Standard on Printed Board Design
Published by IPC on May 1, 2003
This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be...
This document is referenced by:
IPC-2221 GERMAN - Generic Standard on Printed Board Design
Published by IPC on November 1, 2012
A description is not available for this item.
This document is referenced by:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
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