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IPC-4204

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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Organization: IPC
Publication Date: 1 October 2013
Status: inactive
Page Count: 4

Document History

IPC-4204
August 1, 2018
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
This standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible...
IPC-4204
October 1, 2013
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
A description is not available for this item.
IPC-4204
October 1, 2011
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible...
IPC-4204
October 1, 2011
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible...
IPC-4204
May 1, 2002
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
This standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible...

References

This document references:
TM-650 2.5.5.5C - Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band
Published by IPC on March 1, 1998
Summary: This method is intended for the rapid measurement of the X-band (8.00 to 12.40 GHz) apparent relative stripline permittivity (see 9.1) and loss tangent of metal clad substrates. Measurements...
This document references:
TM-650 2.6.1G - Fungus Resistance of Printed Board Materials
Published by IPC on March 1, 2007
The fungus resistance test is used to determine the resistance of materials to fungi and to determine if such material is adversely affected by fungi under conditions favorable for their development,...
This document references:
IPC-9191 - General Guidelines for Implementation of Statistical Process Control (SPC)
Published by IPC on November 1, 1999
This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and...
This document references:
IPC-4202 - Flexible Base Dielectrics for Use in Flexible Printed Boards
Published by IPC on December 1, 2016
This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed...
This document is referenced by:
IPC-4203 - Cover and Bonding Material for Flexible Printed Circuitry
Published by IPC on March 1, 2018
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as...
This document is referenced by:
IPC-2223 - Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
Published by IPC on January 1, 2020
This standard establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. The...
This document is referenced by:
IPC-4203 - Cover and Bonding Material for Flexible Printed Circuitry
Published by IPC on March 1, 2018
This standard establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as...
This document is referenced by:
IPC-2221 - Generic Standard on Printed Board Design
Published by IPC on June 1, 2018
A description is not available for this item.
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