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JEDEC JEP 144

Guideline for Internal Gas Analysis for Microelectronic Packages

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Organization: JEDEC
Publication Date: 1 November 2011
Status: active
Page Count: 36
scope:

This guideline is applicable to hermetically sealed microelectronic components (including discrete semiconductors, monolithic and hybrid microcircuits). Specific cases with unique packaging, materials, or environmental constraints may not find all of the following information and procedures applicable. A compendium of references to reports, papers, and texts, relating to internal gas analysis, volatile gasses, and sealed packages is included in Annex D.

This guideline describes how to select a lab, the internal gas analysis testing process, and the interpretation of the test results. Lists of common failure mechanisms can be found in Annex A. A brief discussion of process characterization and process control is included. Annex C contains supplemental methods for measuring moisture content along with their advantages and disadvantages.

Document History

JEDEC JEP 144
November 1, 2011
Guideline for Internal Gas Analysis for Microelectronic Packages
This guideline is applicable to hermetically sealed microelectronic components (including discrete semiconductors, monolithic and hybrid microcircuits). Specific cases with unique packaging,...
July 1, 2002
Guideline for Residual Gas Analysis (RGA) for Microelectronic Packages
The intent of this document is to give guidance on the Residual Gas Analysis (RGA) process and surrounding issues. The guideline describes how to select a suitable test lab and includes RGA history,...

References

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