DLA - SMD-5962-87617 REV A
MICROCIRCUIT, HYBRID, DIGITAL, HIGH VOLTAGE DRIVERS
| Organization: | DLA |
| Publication Date: | 23 March 1992 |
| Status: | inactive |
| Page Count: | 9 |
scope:
This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-H-38534.
The complete PIN shall be as shown in the following example:
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 0006 1.5 amperes, high voltage driver 02 0008 3.0 amperes, high voltage, high current driver
The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:
Outline letter Case outline X See figure 1 (10-lead, .370" × .185"), can package
Peak power supply voltage (VP), for less than 0.1 s - - +60 V dc Continuous supply voltage (VS) - - - - - - - - - - - - +45 V dc Input voltage (VIN) - - - - - - - - - - - - - - - - - - +5.5 V dc Input extender current (IX) - - - - - - - - - - - - - - 5.0 mA Peak output current (IOUT), 50 ms on, 1 s off: Device type 01 - - - - - - - - - - - - - - - - - - - 1.5 A Device type 02 - - - - - - - - - - - - - - - - - - - 3.0 A Continuous output current (IOUTC): Device type 01 - - - - - - - - - - - - - - - - - - - 0.4 A Device type 02 - - - - - - - - - - - - - - - - - - - 0.5 A Thermal resistance, junction-to-case (ΘJC) - - - - - - (See MIL-M-38510, appendix C) Power dissipation (PD), TA = +25°C: Device type 01 - - - - - - - - - - - - - - - - - - - 750 mW 2/ Device type 02 - - - - - - - - - - - - - - - - - - - 950 mW 2/ Junction temperature (TJ) - - - - - - - - - - - - - - - +175°C Storage temperature range - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - +300°C
Ambient operating temperature range (TA) - - - - - - - −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for original equipment design applications and logistic support of existing equipment.
Document History