scope:

This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN).

The PIN shall be as shown in the following example.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 0006, 51992 1.5 amperes, high voltage driver 02 0008 3.0 amperes, high voltage, high current driver

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 10 Can

The lead finish shall be as specified in MIL-PRF-38534.

Peak power supply voltage (V_P), for less than 0.1 s ........ +60 V dc Continuous supply voltage (V_S) ............................. +45 V dc Input voltage (V_IN) ........................................ +5.5 V dc Input extender current (I_X) ................................ 5.0 mA Peak output current (I_OUT), 50 ms on, 1 s off: Device type 01............................................. 1.5 A Device type 02............................................. 3.0 A Continuous output current (I_OUTC): Device type 01 ............................................ 0.4 A Device type 02 ............................................ 0.5 A Thermal resistance, junction-to-case (θ_JC) ................. (See MIL-STD-1835) Power dissipation (P_D), T_A=+25°C: Device type 01 ............................................ 750 mW 2/ Device type 02 ............................................ 950 mW 2/ Junction temperature (T_J) .................................. +175°C Storage temperature range .................................. −65°C to +150°C Lead temperature (soldering, 10 seconds) ................... +300°C

Ambient operating temperature range(T_A) .................... −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.