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NPFC - MIL-C-47113

COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE

inactive
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Organization: NPFC
Publication Date: 2 October 1992
Status: inactive
Page Count: 1

Document History

May 10, 2017
Compound, Heat Sink, Silicone and/or Non-Silicone
A description is not available for this item.
May 15, 2012
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal
November 17, 2006
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
September 25, 2001
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal.
April 12, 1999
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
The material covered by this specification is intended for use in improving thermal conductivity at heat sink junctions. Caution: When this material is initially applied under devices which are...
October 18, 1996
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
February 6, 1996
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
February 28, 1994
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
September 13, 1993
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
MIL-C-47113
October 2, 1992
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
November 28, 1986
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
This material is intended for use in improving thermal conductivity at heat sink junctions. Caution: When this material is initially applied under devices which are torque set, the zinc oxide filler...
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
September 28, 1983
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
April 16, 1982
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
May 24, 1974
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
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