NPFC - MIL-C-47113
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
inactive
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| Organization: | NPFC |
| Publication Date: | 28 November 1986 |
| Status: | inactive |
| Page Count: | 11 |
scope:
This specification covers a silicone and/or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal (see 6.1).
intended Use:
This material is intended for use in improving thermal conductivity at heat sink junctions. Caution: When this material is initially applied under devices which are torque set, the zinc oxide... View More
Document History
May 11, 2022
Compound, Heat Sink, Silicone and/or Non-Silicone
A description is not available for this item.
May 10, 2017
Compound, Heat Sink, Silicone and/or Non-Silicone
A description is not available for this item.
May 15, 2012
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal
November 17, 2006
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
September 25, 2001
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal.
April 12, 1999
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
The material covered by this specification is intended for use in improving thermal conductivity at heat sink junctions.
Caution: When this material is initially applied under devices which are...
October 18, 1996
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
February 6, 1996
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
February 28, 1994
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
September 13, 1993
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
October 2, 1992
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
MIL-C-47113
November 28, 1986
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
This material is intended for use in improving thermal conductivity at heat sink junctions. Caution: When this material is initially applied under devices which are torque set, the zinc oxide filler...
May 24, 1984
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
September 28, 1983
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
April 16, 1982
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.
May 24, 1974
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
A description is not available for this item.