NPFC - MIL-DTL-47113
COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE
|Publication Date:||25 September 2001|
This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal.
General. The material covered by this specification is intended for use in improving thermal conductivity at heat sink junctions.