scope:

This specification covers the detail requirements for monolithic silicon, high speed, TTL, bistable logic microcircuits. Qualification requirements are removed for device types 01, 02, 03, 05, and 06. These device types are inactive for new design after the date of this revision. For the remaining device type, 04, two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number.

The part number shall be in accordance with MIL-M-38510.

Device types shall be as shown in the following:

Device type 1/ Circuit 01 Single J-K master-slave flip-flop 02 Dual J-K master-slave flip-flop 03 Dual D-type edge-triggered flip-flop 04 Dual J-K master-slave flip-flop 05 Single J-K edge-triggered flip-flop 06 Dual J-K edge-triggered flip-flop

Device class shall be the product assurance level as defined in MIL-M-38510.

The case outlines shall be designated as follows:

Outline letter Case outline (see MIL-M-38510, appendix C) A F-1 (14-lead, ¼" × ¼"), flat package B F-3 (14-lead, ¼" × ⅛"), flat package C D-1 (14-lead, ¼" × ¾"), dual-in-line package D F-2 (14-lead, ¼" × ⅜"), flat package E D-2 (16-lead, ¼" × ⅞"), dual-in-line package F F-5 (16-lead, ¼" × ⅜"), flat package

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Rome Air Development Center AFSC, RADC/RBE-2, Griffiss AFB, NY 13441-5700, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

Supply voltage range - - - - - - - - - - - - −0.5 to 7.0 V dc Input voltage range- - - - - - - - - - - - - −1.5 V dc at 12 mA to 5.5 V dc Storage temperature range- - - - - - - - - - −65°C to 150°C Maximum power dissipation per flip-flop (P_D): 2/ Device types 01, 02, 03, and 04 1/ - - - - 137 mW Device types 05 and 06 1/- - - - - - - - - 210 mW Lead temperature (soldering, 10 seconds) - - +300°C Thermal resistance, junction-to-case (θ_JC): Flat package - - - - - - - - - - - - - - - 0.09°C/mW Dual-in-line package - - - - - - - - - - - 0.08°C/mW Junction temperature (T_J)- - - - - - - - - +175°C

Supply voltage- - - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage- - - - - - 2.0 V dc Maximum low level input voltage - - - - - - 0.8 V dc Normalized fanout (each output): 3/ Device types 01, 02, 04, 05, and 06 1/- - 10 maximum Case operating temperature range (T_C) - - - −55°C to +125°C Width of clock pulse, t_p (clock): Device types 01, 02, and 04 1/ - - - - - 12 ns, minimum Device types 03 1/ - - - - - - - - - - - 15 ns, minimum Device types 05 and 06 1/- - - - - - - - 10 ns, minimum Width of preset or clear pulse: Device types 01, 02, 04, 05, and 06 1/ - 16 ns, minimum Device type 03 1/- - - - - - - - - - - - 25 ns, minimum Input setup time t_(setup): Device types 01, 02 and 04 1/ - - - - - - ≥t_p(clock) Input hold time t_(hold) - - - - - - - - - - 5 minimum

intended Use:

Microcircuits conforming to this specification are intended for original equipment design application and logistic support of existing equipment.