scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V devices shall meet or exceed the electrical performance characteristics specified in table I herein after exposure to the specified irradiation levels specified in the absolute maximum ratings herein and the RHA marked device shall be marked in accordance with MIL-I-38535. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 7C285 64K × 8-bit Fast Column Access UVEPROM 85 ns 02 7C285 64K × 8-bit Fast Column Access UVEPROM 75 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style 2/ X GDIP4-T28 or CDIP3-T28 28 dual-in-line Y CQCC1-N32 32 rectangular leadless chip carrier Z GDFP2-F28 28 flat pack

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

V_CC supply voltage range with respect to ground . . . . −0.5 V dc to +7.0 V dc Voltage applied to outputs in high Z state . . . . . . −0.5 V dc to +7.0 V dc Input voltage range with respect to ground . . . . . . −3.0 V dc to +7.0 V dc Maximum power dissipation (P_D). . . . . . . . . . . . . 1.1 W 4/ Lead temperature (soldering, 10 seconds) . . . . . . . +260°C Thermal resistance, junction-to-case (θ_JC) . . . . . . See MIL-STD-1835 Junction temperature (T_J) . . . . . . . . . . . . . . . +175°C 5/ Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Temperature under bias . . . . . . . . . . . . . . . . −55°C to +125°C Endurance . . . . . . . . . . . . . . . . . . . . . . . 25 cycles/byte, minimum Data retention . . . . . . . . . . . . . . . . . . . . 10 years, minimum

Supply voltage (V_CC). . . . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Ground voltage (GND). . . . . . . . . . . . . . . . . . 0 V dc Input high voltage (V_IH). . . . . . . . . . . . . . . . 2.0 V dc minimum Input low voltage (V_IL) . . . . . . . . . . . . . . . . 0.8 V dc maximum Case operating temperature range (T_C) . . . . . . . . . −55°C to 125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012). . . . . . . . XX percent 6/

intended Use: